features common anode small 1.6 x 1.5 x 0.35 mm package diffused optics red/green/blue color combination available in 8 mm tape on 7" diameter reels high brightness using alingap and ingan die technology compatible with reflow soldering applications backlighting status indicator front panel indicator office automation, home appliances, industrial equipment description the HSMF-C114 tricolor chip-type led is designed in an ultra small package for miniaturiza-tion. it is the first of its kind to achieve such small packaging and be the thinnest package in the industry for tricolor package. with the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. the small size, narrow footprint, and low profile make this led excellent for back-lighting, status indication, and front panel illumination applications. in order to facilitate pick and place operation, this chipled is shipped in tape and reel, with 4000 units per reel. the package is compatible with reflow soldering and binned by both color and intensity. caution: HSMF-C114 leds are class 1a esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. HSMF-C114 surface mount tricolor chipleds data sheet
2 package dimensions absolute maximum ratings at t a = 25 c parameter alingap red ingan green ingan blue units dc forward current [1,3] 20 20 20 ma power dissipation [1] 48 78 78 mw dc forward current [2] 15 15 15 ma power dissipation [2] 36 59 59 mw reverse voltage (i r = 100 a) 5 5 5 v led junction temperature 95 95 95 c operating temperature range -30 to 85 c storage temperature range -40 to 85 c soldering temperature see reflow soldering profile (figures 7 & 8) notes: 1. applies when single led is lit up. 2. applies when all 3 leds are lit up simultaneously. 3. derate linearly as shown in figure 4. 4. drive currents above 5 ma are recommended for best long term performance. blue green red 4 3 2 1 pc board notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. diffused epoxy 4 3 2 1 anode mark anode mark 1.60 (0.063) 1.10 (0.043) 0.40 0.15 (0.016 0.006) 0.12 (0.005) 0.50 (0.020) 0.40 (0.016) 0.35 (0.014) 1.50 (0.059) common anode
3 electrical characteristics at t a = 25 c forward voltage v f (volts) [1] reverse breakdown capacitance @ i f = 20 ma v r (volts) @ i r = 100 ac (pf), @ v f = 0, f = 1 mhz part number typ. max. min. typ. alingap red 1.9 2.4 5 10 ingan green 3.4 3.9 5 65 ingan blue 3.4 3.9 5 65 note: 1. v f tolerance: 0.1 v. optical characteristics at t a = 25 c peak color, dominant viewing angle luminous luminous intensity wavelength wavelength 2 q 1/2 [3] efficacy i v [1] (mcd) @ 20 ma l peak (nm) l d [2] (nm) (degrees) h v (lm/w) part number min. typ. typical typical typical typical alingap red 28.5 150.0 637 626 100 155 ingan green 45.0 180.0 523 525 145 477 ingan blue 28.5 70.0 468 470 145 75 notes: 1. the luminous intensity i v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the led package. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. caution: 1. the above optical performance specifications are valid in the case when single led is lit up. 2. the above product specifications do not provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 led is lit. 3. please refer to avago technologies? application brief ab d-007 for additional details/explanation on driving the part in parallel circuit.
4 light intensity (i v ) bin limits [1] intensity (mcd) bin id minimum maximum a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l11 .20 18.00 m18 .00 28.50 n28 .50 45.00 p45 .00 71.50 q7 1.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 tolerance: 15% note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your avago representative for information on current available bins. alingap red color bin limits [1] dom. wavelength (nm) bin id minimum maximum ?20 .0 635.0 tolerance: 1 nm ingan green color bin limits [1] dom. wavelength (nm) bin id minimum maximum a515 .0 520.0 b520 .0 525.0 c525 .0 530.0 d530 .0 535.0 tolerance: 1 nm ingan blue color bin limits [1] dom. wavelength (nm) bin id minimum maximum a460 .0 465.0 b465 .0 470.0 c470 .0 475.0 d475 .0 480.0 tolerance: 1 nm note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your avago representative for information on current available bins. figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. luminous intensity vs. forward current. figure 3. luminous intensity vs. forward current. 400 1.2 1.0 0 600 700 0.2 relative intensity wavelength ?nm 500 0.6 0.4 0.8 450 550 650 ingan blue ingan green alingap red 100 10 1 0.1 1.6 2.1 3.1 v f ?forward voltage ?v i f ?forward current ?ma 2.6 ingan green & blue alingap red 05 15 i f ?forward current ?ma 0 0.4 relative intensity 0.8 0.2 1.0 10 0.6 1.2 ingan green & blue 20 alingap red
5 figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle (alingap red). figure 7. recommended reflow soldering profile. 0 25 0 20 60 80 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ? c 40 15 20 10 10 30 50 70 90 230 c max. 10 sec. max. 4 c/sec. max. over 2 min. time temperature 4 c/sec. max. 140-160 c ? c/sec. max. figure 8. recommended pb-free reflow soldering profile. relative intensity 1.2 0 angular displacement ?degrees ( ) 1.0 0.6 0.2 0.4 0.8 -70 -50 -30 0 20 30 5 07090 -90 -20 -80 -60 -40 -10 10 40 60 80 figure 6. relative intensity vs. angle (ingan green and blue). relative intensity 1.2 0 angular displacement ?degrees ( ) 1.0 0.6 0.2 0.4 0.8 -70 -50 -30 0 20 30 5 07090 -90 -20 -80 -60 -40 -10 10 40 60 80 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. (acc. to j-std-020c) 10 to 30 sec. time temperature
6 figure 9. recommended soldering land pattern. figure 10. reeling orientation. figure 11. reel dimensions. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x 0.9 0.6 0.5 0.9 0.6 0.6 10.50 1.0 (0.413 0.039) 59.60 1.00 (2.346 0.039) note: 1. all dimensions in millimeters (inches). 20.20 min. (0.795 min.) 6 ps 178.40 1 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) 13.1 0.5 (0.516 0.020) 8.0 1.0 (0.315 0.039)
7 figure 12. tape dimensions. 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.254 0.05 (0.010 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) dim. a 0.10 ( 0.004) 1.75 (0.069) dim. b 0.10 ( 0.004) 1.65 (0.065) part number HSMF-C114 dim. c 0.10 ( 0.004) 0.55 (0.022) figure 13. tape leader and trailer dimensions. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components. there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape.
convective ir reflow soldering for more information on reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30?c @ 60% rh max. baking is required before mounting if: 1. humidity indicator card is > 10% when read at 23 5 c. 2. device exposed to factory conditions < 30 c/60% rh more than 672 hours. recommended baking condition: 60 5?c for 20 hours. for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. obsoletes 5989-3351en 5989-4809en october 17, 2006
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